LEAPS: Topological-Layout-Adaptable Multi-Die FPGA Placement for Super Long Line Minimization

Abstract

Multi-die FPGAs are crucial components in modern computing systems, particularly for high-performance applications such as artificial intelligence and data centers. Super long lines (SLLs) provide interconnections between super logic regions (SLRs) for a multi-die FPGA on a silicon interposer. They have significantly higher delay compared to regular interconnects, which need to be minimized. With the increase in design complexity, the growth of SLLs gives rise to challenges in timing and power closure. Existing placement algorithms focus on optimizing the number of SLLs but often face limitations due to specific topologies of SLRs. Furthermore, they fall short of achieving continuous optimization of SLLs throughout the entire placement process. This highlights the necessity for more advanced and adaptable solutions. In this paper, we propose LEAPS, a comprehensive, systematic, and adaptable multi-die FPGA placement algorithm for SLL minimization. Our contributions are threefold: 1) proposing a high-performance global placement algorithm for multi-die FPGAs that optimizes the number of SLLs while addressing other essential design constraints such as wirelength, routability, and clock routing; 2) introducing a versatile method for more complex SLR topologies of multi-die FPGAs, surpassing the limitations of existing approaches; and 3) executing continuous optimization of SLL counts across the whole placement stages, including global placement (GP), legalization (LG), and detailed placement (DP). Experimental results demonstrate the effectiveness of LEAPS in reducing SLLs and enhancing circuit performance. Compared with the most recent state-of-the-art (SOTA) method, LEAPS achieves an average reduction of 43.08% in SLL counts and 9.99% in HPWL while exhibiting a notable 34.34x improvement in runtime.